Jose L. Silva-Perales, Daniel Garcia Garcia, Carlos J. Franco-Tinoco. Impedance vs coupling noise analysis and tradeoff on power delivery filters based on package layout interconnections. In 9th IEEE Latin American Symposium on Circuits & Systems, LASCAS 2018, Puerto Vallarta, Mexico, February 25-28, 2018. pages 1-4, IEEE, 2018. [doi]
@inproceedings{Silva-PeralesGF18,
title = {Impedance vs coupling noise analysis and tradeoff on power delivery filters based on package layout interconnections},
author = {Jose L. Silva-Perales and Daniel Garcia Garcia and Carlos J. Franco-Tinoco},
year = {2018},
doi = {10.1109/LASCAS.2018.8399952},
url = {https://doi.org/10.1109/LASCAS.2018.8399952},
researchr = {https://researchr.org/publication/Silva-PeralesGF18},
cites = {0},
citedby = {0},
pages = {1-4},
booktitle = {9th IEEE Latin American Symposium on Circuits & Systems, LASCAS 2018, Puerto Vallarta, Mexico, February 25-28, 2018},
publisher = {IEEE},
isbn = {978-1-5386-2311-4},
}