Layout Based 3D Thermal Simulations of Integrated Circuits Components - researchr publication authors

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Krzysztof Slusarczyk, Marek Kaminski, Andrzej Napieralski. Layout Based 3D Thermal Simulations of Integrated Circuits Components. In Marian Bubak, G. Dick van Albada, Peter M. A. Sloot, Jack Dongarra, editors, Computational Science - ICCS 2004, 4th International Conference, Kraków, Poland, June 6-9, 2004, Proceedings, Part IV. Volume 3039 of Lecture Notes in Computer Science, pages 1029-1036, Springer, 2004. [doi]

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