Thermal-Aware Floorplan Schemes for Reliable 3D Multi-core Processors

Dong Oh Son, Young-Jin Park, Jin Woo Ahn, Jae Hyung Park, Jong Myon Kim, Cheol Hong Kim. Thermal-Aware Floorplan Schemes for Reliable 3D Multi-core Processors. In Beniamino Murgante, Osvaldo Gervasi, Andrés Iglesias, David Taniar, Bernady O. Apduhan, editors, Computational Science and Its Applications - ICCSA 2011 - International Conference, Santander, Spain, June 20-23, 2011. Proceedings, Part II. Volume 6783 of Lecture Notes in Computer Science, pages 463-474, Springer, 2011. [doi]

Abstract

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