Full-chip multiple TSV-to-TSV coupling extraction and optimization in 3D ICs

Taigon Song, Chang Liu, Yarui Peng, Sung Kyu Lim. Full-chip multiple TSV-to-TSV coupling extraction and optimization in 3D ICs. In The 50th Annual Design Automation Conference 2013, DAC '13, Austin, TX, USA, May 29 - June 07, 2013. pages 180, ACM, 2013. [doi]

Abstract

Abstract is missing.