Ashok Sridhar, Sandeep M. Perinchery, Edsger C. P. Smits, Rajesh Mandamparambil, Jeroen van den Brand. Reliability investigations on LIFT-printed isotropic conductive adhesive joints for system-in-foil applications. Microelectronics Reliability, 55(11):2324-2330, 2015. [doi]
@article{SridharPSMB15,
title = {Reliability investigations on LIFT-printed isotropic conductive adhesive joints for system-in-foil applications},
author = {Ashok Sridhar and Sandeep M. Perinchery and Edsger C. P. Smits and Rajesh Mandamparambil and Jeroen van den Brand},
year = {2015},
doi = {10.1016/j.microrel.2015.07.006},
url = {http://dx.doi.org/10.1016/j.microrel.2015.07.006},
researchr = {https://researchr.org/publication/SridharPSMB15},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {55},
number = {11},
pages = {2324-2330},
}