Reliability investigations on LIFT-printed isotropic conductive adhesive joints for system-in-foil applications

Ashok Sridhar, Sandeep M. Perinchery, Edsger C. P. Smits, Rajesh Mandamparambil, Jeroen van den Brand. Reliability investigations on LIFT-printed isotropic conductive adhesive joints for system-in-foil applications. Microelectronics Reliability, 55(11):2324-2330, 2015. [doi]

Abstract

Abstract is missing.