Corrections to Analytical Expressions for High-Frequency VLSI Interconnect Impedance Extraction in the Presence of a Multilayer Conductive Substrate [Jul 09 1047-1060]

Navin Srivastava, Chuan Xu, Roberto Suaya, Kaustav Banerjee. Corrections to Analytical Expressions for High-Frequency VLSI Interconnect Impedance Extraction in the Presence of a Multilayer Conductive Substrate [Jul 09 1047-1060]. IEEE Trans. on CAD of Integrated Circuits and Systems, 29(5):849, 2010. [doi]

@article{SrivastavaXSB10,
  title = {Corrections to  Analytical Expressions for High-Frequency VLSI Interconnect Impedance Extraction in the Presence of a Multilayer Conductive Substrate  [Jul 09 1047-1060]},
  author = {Navin Srivastava and Chuan Xu and Roberto Suaya and Kaustav Banerjee},
  year = {2010},
  doi = {10.1109/TCAD.2010.2047753},
  url = {http://dx.doi.org/10.1109/TCAD.2010.2047753},
  researchr = {https://researchr.org/publication/SrivastavaXSB10},
  cites = {0},
  citedby = {0},
  journal = {IEEE Trans. on CAD of Integrated Circuits and Systems},
  volume = {29},
  number = {5},
  pages = {849},
}