Serguei Stoukatch, Nicolas André, Thibault Delhaye, François Dupont, Jean-Michel Redouté, Denis Flandre. Anisotropic conductive film & flip-chip bonding for low-cost sensor prototyping on rigid & flex PCB. In 2020 IEEE Sensors, Rotterdam, The Netherlands, October 25-28, 2020. pages 1-4, IEEE, 2020. [doi]
Abstract is missing.