Cost and Thermal Analysis of High-Performance 2.5D and 3D Integrated Circuit Design Space - researchr publication authors

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Dylan Stow, Itir Akgun, Russell Barnes, Peng Gu, Yuan Xie 0001. Cost and Thermal Analysis of High-Performance 2.5D and 3D Integrated Circuit Design Space. In IEEE Computer Society Annual Symposium on VLSI, ISVLSI 2016, Pittsburgh, PA, USA, July 11-13, 2016. pages 637-642, IEEE, 2016. [doi]

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