Cost and Thermal Analysis of High-Performance 2.5D and 3D Integrated Circuit Design Space

Dylan Stow, Itir Akgun, Russell Barnes, Peng Gu, Yuan Xie 0001. Cost and Thermal Analysis of High-Performance 2.5D and 3D Integrated Circuit Design Space. In IEEE Computer Society Annual Symposium on VLSI, ISVLSI 2016, Pittsburgh, PA, USA, July 11-13, 2016. pages 637-642, IEEE, 2016. [doi]

@inproceedings{StowABG016,
  title = {Cost and Thermal Analysis of High-Performance 2.5D and 3D Integrated Circuit Design Space},
  author = {Dylan Stow and Itir Akgun and Russell Barnes and Peng Gu and Yuan Xie 0001},
  year = {2016},
  doi = {10.1109/ISVLSI.2016.133},
  url = {http://doi.ieeecomputersociety.org/10.1109/ISVLSI.2016.133},
  researchr = {https://researchr.org/publication/StowABG016},
  cites = {0},
  citedby = {0},
  pages = {637-642},
  booktitle = {IEEE Computer Society Annual Symposium on VLSI, ISVLSI 2016, Pittsburgh, PA, USA, July 11-13, 2016},
  publisher = {IEEE},
  isbn = {978-1-4673-9039-2},
}