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Rate-dependent properties of Sn-Ag-Cu based lead-free solder joints for WLCSP

Y. A. Su, L. B. Tan, T. Y. Tee, V. B. C. Tan. Rate-dependent properties of Sn-Ag-Cu based lead-free solder joints for WLCSP. Microelectronics Reliability, 50(4):564-576, 2010. [doi]

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Y. A. Su

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L. B. Tan

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T. Y. Tee

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V. B. C. Tan

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