Rate-dependent properties of Sn-Ag-Cu based lead-free solder joints for WLCSP

Y. A. Su, L. B. Tan, T. Y. Tee, V. B. C. Tan. Rate-dependent properties of Sn-Ag-Cu based lead-free solder joints for WLCSP. Microelectronics Reliability, 50(4):564-576, 2010. [doi]

Abstract

Abstract is missing.