Physically-Based Simulation of Electromigration Induced Failures in Copper Dual-Damascene Interconnect

Valeriy Sukharev. Physically-Based Simulation of Electromigration Induced Failures in Copper Dual-Damascene Interconnect. In 5th International Symposium on Quality of Electronic Design (ISQED 2004), 22-24 March 2004, San Jose, CA, USA. pages 225-231, IEEE Computer Society, 2004. [doi]

Authors

Valeriy Sukharev

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