Valeriy Sukharev. Physically-Based Simulation of Electromigration Induced Failures in Copper Dual-Damascene Interconnect. In 5th International Symposium on Quality of Electronic Design (ISQED 2004), 22-24 March 2004, San Jose, CA, USA. pages 225-231, IEEE Computer Society, 2004. [doi]
Abstract is missing.