Design and feasibility of multi-Gb/s quasi-serial vertical interconnects based on TSVs for 3D ICs - researchr publication authors

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Fengda Sun, Alessandro Cevrero, Panagiotis Athanasopoulos, Yusuf Leblebici. Design and feasibility of multi-Gb/s quasi-serial vertical interconnects based on TSVs for 3D ICs. In 18th IEEE/IFIP VLSI-SoC 2010, IEEE/IFIP WG 10.5 International Conference on Very Large Scale Integration of System-on-Chip, Madrid, Spain, 27-29 September 2010. pages 149-154, IEEE, 2010. [doi]

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