Fengda Sun, Alessandro Cevrero, Panagiotis Athanasopoulos, Yusuf Leblebici. Design and feasibility of multi-Gb/s quasi-serial vertical interconnects based on TSVs for 3D ICs. In 18th IEEE/IFIP VLSI-SoC 2010, IEEE/IFIP WG 10.5 International Conference on Very Large Scale Integration of System-on-Chip, Madrid, Spain, 27-29 September 2010. pages 149-154, IEEE, 2010. [doi]
@inproceedings{SunCAL10,
title = {Design and feasibility of multi-Gb/s quasi-serial vertical interconnects based on TSVs for 3D ICs},
author = {Fengda Sun and Alessandro Cevrero and Panagiotis Athanasopoulos and Yusuf Leblebici},
year = {2010},
doi = {10.1109/VLSISOC.2010.5642604},
url = {http://dx.doi.org/10.1109/VLSISOC.2010.5642604},
tags = {design},
researchr = {https://researchr.org/publication/SunCAL10},
cites = {0},
citedby = {0},
pages = {149-154},
booktitle = {18th IEEE/IFIP VLSI-SoC 2010, IEEE/IFIP WG 10.5 International Conference on Very Large Scale Integration of System-on-Chip, Madrid, Spain, 27-29 September 2010},
publisher = {IEEE},
}