Yan-Ning Sun, Yu Chen, Wu-Yin Wang, Hong-wei Xu, Wei Qin. Modelling and Prediction of Injection Molding Process Using Copula Entropy and Multi-Output SVR. In 17th IEEE International Conference on Automation Science and Engineering, CASE 2021, Lyon, France, August 23-27, 2021. pages 1677-1682, IEEE, 2021. [doi]
@inproceedings{SunCWXQ21,
title = {Modelling and Prediction of Injection Molding Process Using Copula Entropy and Multi-Output SVR},
author = {Yan-Ning Sun and Yu Chen and Wu-Yin Wang and Hong-wei Xu and Wei Qin},
year = {2021},
doi = {10.1109/CASE49439.2021.9551391},
url = {https://doi.org/10.1109/CASE49439.2021.9551391},
researchr = {https://researchr.org/publication/SunCWXQ21},
cites = {0},
citedby = {0},
pages = {1677-1682},
booktitle = {17th IEEE International Conference on Automation Science and Engineering, CASE 2021, Lyon, France, August 23-27, 2021},
publisher = {IEEE},
isbn = {978-1-6654-1873-7},
}