Siyu Sun, Qiang Guo, Hongtao Chen, Mingyu Li, Chunqing Wang. Solderless bonding with nanoporous copper as interlayer for high-temperature applications. Microelectronics Reliability, 80:198-204, 2018. [doi]
@article{SunGCLW18,
title = {Solderless bonding with nanoporous copper as interlayer for high-temperature applications},
author = {Siyu Sun and Qiang Guo and Hongtao Chen and Mingyu Li and Chunqing Wang},
year = {2018},
doi = {10.1016/j.microrel.2017.12.012},
url = {https://doi.org/10.1016/j.microrel.2017.12.012},
researchr = {https://researchr.org/publication/SunGCLW18},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {80},
pages = {198-204},
}