Plastic analysis for through silicon via with actual etching defect of triangular-teeth and scallops

Yun-Na Sun, Dongwoo Kang, Yazhou Zhang, Jiangbo Luo, Yanmei Liu, Yan Wang, Guifu Ding. Plastic analysis for through silicon via with actual etching defect of triangular-teeth and scallops. Microelectronics Reliability, 75:43-52, 2017. [doi]

Abstract

Abstract is missing.