Thin film joining for high-temperature performance of power semi-conductor devices

Toshihide Takahashi, Shuichi Komatsu, Hiroshi Nishikawa, Tadashi Takemoto. Thin film joining for high-temperature performance of power semi-conductor devices. Microelectronics Reliability, 50(2):220-227, 2010. [doi]

Abstract

Abstract is missing.