Satoshi Takaya, Makoto Nagata, Atsushi Sakai, Takashi Kariya, Shiro Uchiyama, Harufumi Kobayashi, Hiroaki Ikeda. A 100GB/s wide I/O with 4096b TSVs through an active silicon interposer with in-place waveform capturing. In 2013 IEEE International Solid-State Circuits Conference - Digest of Technical Papers, ISSCC 2013, San Francisco, CA, USA, February 17-21, 2013. pages 434-435, IEEE, 2013. [doi]
Abstract is missing.