A non-destructive technique using 3D X-ray Computed Tomography to reveal semiconductor internal physical defects

C. H. Tan, C. K. Lau. A non-destructive technique using 3D X-ray Computed Tomography to reveal semiconductor internal physical defects. In 2013 IEEE International Conference on Signal and Image Processing Applications, Melaka, Malaysia, October 8-10, 2013. pages 55-60, IEEE, 2013. [doi]

@inproceedings{TanL13-1,
  title = {A non-destructive technique using 3D X-ray Computed Tomography to reveal semiconductor internal physical defects},
  author = {C. H. Tan and C. K. Lau},
  year = {2013},
  doi = {10.1109/ICSIPA.2013.6707977},
  url = {http://dx.doi.org/10.1109/ICSIPA.2013.6707977},
  researchr = {https://researchr.org/publication/TanL13-1},
  cites = {0},
  citedby = {0},
  pages = {55-60},
  booktitle = {2013 IEEE International Conference on Signal and Image Processing Applications, Melaka, Malaysia, October 8-10, 2013},
  publisher = {IEEE},
}