Y. Y. Tan, Q. L. Yang, K. S. Sim, Li Tao Sun, Xing Wu. Cu-Al intermetallic compound investigation using ex-situ post annealing and in-situ annealing. Microelectronics Reliability, 55(11):2316-2323, 2015. [doi]
@article{TanYSSW15,
title = {Cu-Al intermetallic compound investigation using ex-situ post annealing and in-situ annealing},
author = {Y. Y. Tan and Q. L. Yang and K. S. Sim and Li Tao Sun and Xing Wu},
year = {2015},
doi = {10.1016/j.microrel.2015.06.050},
url = {http://dx.doi.org/10.1016/j.microrel.2015.06.050},
researchr = {https://researchr.org/publication/TanYSSW15},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {55},
number = {11},
pages = {2316-2323},
}