Wafer-level Cu-Cu bonding technology

Ya-Sheng Tang, Yao-Jen Chang, Kuan-Neng Chen. Wafer-level Cu-Cu bonding technology. Microelectronics Reliability, 52(2):312-320, 2012. [doi]

Authors

Ya-Sheng Tang

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Yao-Jen Chang

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Kuan-Neng Chen

This author has not been identified. Look up 'Kuan-Neng Chen' in Google