Ya-Sheng Tang, Yao-Jen Chang, Kuan-Neng Chen. Wafer-level Cu-Cu bonding technology. Microelectronics Reliability, 52(2):312-320, 2012. [doi]
@article{TangCC12,
title = {Wafer-level Cu-Cu bonding technology},
author = {Ya-Sheng Tang and Yao-Jen Chang and Kuan-Neng Chen},
year = {2012},
doi = {10.1016/j.microrel.2011.04.016},
url = {http://dx.doi.org/10.1016/j.microrel.2011.04.016},
researchr = {https://researchr.org/publication/TangCC12},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {52},
number = {2},
pages = {312-320},
}