Yu-Hsiang Tang, Yu-Hsin Lin, Tsung-Tao Huang, Jun-Sheng Wang, Ming-Hua Shiao, Chih-Sheng Yu. Investigation of fabricated Through Glass Via (TGV) process by inductively coupled plasma reactive ion etching of quartz glass. In 10th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2015, Xi'an, China, April 7-11, 2015. pages 401-404, IEEE, 2015. [doi]
@inproceedings{TangLHWSY15,
title = {Investigation of fabricated Through Glass Via (TGV) process by inductively coupled plasma reactive ion etching of quartz glass},
author = {Yu-Hsiang Tang and Yu-Hsin Lin and Tsung-Tao Huang and Jun-Sheng Wang and Ming-Hua Shiao and Chih-Sheng Yu},
year = {2015},
doi = {10.1109/NEMS.2015.7147453},
url = {http://dx.doi.org/10.1109/NEMS.2015.7147453},
researchr = {https://researchr.org/publication/TangLHWSY15},
cites = {0},
citedby = {0},
pages = {401-404},
booktitle = {10th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2015, Xi'an, China, April 7-11, 2015},
publisher = {IEEE},
isbn = {978-1-4673-6695-3},
}