Yu-Hsiang Tang, Yu-Hsin Lin, Tsung-Tao Huang, Jun-Sheng Wang, Ming-Hua Shiao, Chih-Sheng Yu. Investigation of fabricated Through Glass Via (TGV) process by inductively coupled plasma reactive ion etching of quartz glass. In 10th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2015, Xi'an, China, April 7-11, 2015. pages 401-404, IEEE, 2015. [doi]
Abstract is missing.