Warpage variations of Si/solder/OFHC-Cu layered plates subjected to cyclic thermal loading

Hisashi Tanie, Kazuhiko Nakane, Yusuke Urata, Masatoshi Tsuda, Nobutada Ohno. Warpage variations of Si/solder/OFHC-Cu layered plates subjected to cyclic thermal loading. Microelectronics Reliability, 51(9-11):1840-1844, 2011. [doi]

Abstract

Abstract is missing.