A quantitative method of reliability estimation for surface mount solder joints based on heating factor Q::eta::

Bo Tao, Yiping Wu, Han Ding, You-Lun Xiong. A quantitative method of reliability estimation for surface mount solder joints based on heating factor Q::eta::. Microelectronics Reliability, 46(5-6):864-872, 2006. [doi]

Abstract

Abstract is missing.