Mottaqiallah Taouil, Said Hamdioui. Stacking order impact on overall 3D die-to-wafer Stacked-IC cost. In Rolf Kraemer, Adam Pawlak, Andreas Steininger, Mario Schölzel, Jaan Raik, Heinrich Theodor Vierhaus, editors, 14th IEEE International Symposium on Design and Diagnostics of Electronic Circuits & Systems, DDECS 2011, Cottbus, Germany, April 13-15, 2011. pages 335-340, IEEE, 2011. [doi]
Abstract is missing.