Mottaqiallah Taouil, Said Hamdioui. Layer Redundancy Based Yield Improvement for 3D Wafer-to-Wafer Stacked Memories. In 16th European Test Symposium (ETS 2011), May 23-27, 2011, Trondheim, Norway. pages 45-50, IEEE Computer Society, 2011. [doi]
@inproceedings{TaouilH11,
title = {Layer Redundancy Based Yield Improvement for 3D Wafer-to-Wafer Stacked Memories},
author = {Mottaqiallah Taouil and Said Hamdioui},
year = {2011},
doi = {10.1109/ETS.2011.55},
url = {http://doi.ieeecomputersociety.org/10.1109/ETS.2011.55},
tags = {rule-based, redundancy},
researchr = {https://researchr.org/publication/TaouilH11},
cites = {0},
citedby = {0},
pages = {45-50},
booktitle = {16th European Test Symposium (ETS 2011), May 23-27, 2011, Trondheim, Norway},
publisher = {IEEE Computer Society},
isbn = {978-0-7695-4433-5},
}