Mottaqiallah Taouil, Said Hamdioui, Kees Beenakker, Erik Jan Marinissen. Test Cost Analysis for 3D Die-to-Wafer Stacking. In Proceedings of the 19th IEEE Asian Test Symposium, ATS 2010, 1-4 December 2010, Shanghai, China. pages 435-441, IEEE Computer Society, 2010. [doi]
@inproceedings{TaouilHBM10,
title = {Test Cost Analysis for 3D Die-to-Wafer Stacking},
author = {Mottaqiallah Taouil and Said Hamdioui and Kees Beenakker and Erik Jan Marinissen},
year = {2010},
doi = {10.1109/ATS.2010.80},
url = {http://dx.doi.org/10.1109/ATS.2010.80},
tags = {testing, analysis},
researchr = {https://researchr.org/publication/TaouilHBM10},
cites = {0},
citedby = {0},
pages = {435-441},
booktitle = {Proceedings of the 19th IEEE Asian Test Symposium, ATS 2010, 1-4 December 2010, Shanghai, China},
publisher = {IEEE Computer Society},
isbn = {978-0-7695-4248-5},
}