Mottaqiallah Taouil, Said Hamdioui, Kees Beenakker, Erik Jan Marinissen. Test Cost Analysis for 3D Die-to-Wafer Stacking. In Proceedings of the 19th IEEE Asian Test Symposium, ATS 2010, 1-4 December 2010, Shanghai, China. pages 435-441, IEEE Computer Society, 2010. [doi]
Abstract is missing.