Greg Taylor, Ramin Farjadrad, Bapiraju Vinnakota. High Capacity On-Package Physical Link Considerations. In 2019 IEEE Symposium on High-Performance Interconnects, HOTI 2019, Santa Clara, CA, USA, August 14-16, 2019. pages 19-22, IEEE, 2019. [doi]
@inproceedings{TaylorFV19, title = {High Capacity On-Package Physical Link Considerations}, author = {Greg Taylor and Ramin Farjadrad and Bapiraju Vinnakota}, year = {2019}, doi = {10.1109/HOTI.2019.00018}, url = {https://doi.org/10.1109/HOTI.2019.00018}, researchr = {https://researchr.org/publication/TaylorFV19}, cites = {0}, citedby = {0}, pages = {19-22}, booktitle = {2019 IEEE Symposium on High-Performance Interconnects, HOTI 2019, Santa Clara, CA, USA, August 14-16, 2019}, publisher = {IEEE}, isbn = {978-1-7281-5525-8}, }