Reliability assessment and hygroswelling modeling of FCBGA with no-flow underfill

Tong Yan Tee, Chek Lim Kho, Daniel Yap, Carol Toh, Xavier Baraton, Zhaowei Zhong. Reliability assessment and hygroswelling modeling of FCBGA with no-flow underfill. Microelectronics Reliability, 43(5):741-749, 2003. [doi]

Abstract

Abstract is missing.