Microelectromechanical systems in 3D SOI-CMOS: sensing electronics embedded in mechanical structures - researchr publication authors

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Francisco Tejada, Andreas G. Andreou. Microelectromechanical systems in 3D SOI-CMOS: sensing electronics embedded in mechanical structures. In International Symposium on Circuits and Systems (ISCAS 2006), 21-24 May 2006, Island of Kos, Greece. IEEE, 2006. [doi]

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