Microelectromechanical systems in 3D SOI-CMOS: sensing electronics embedded in mechanical structures

Francisco Tejada, Andreas G. Andreou. Microelectromechanical systems in 3D SOI-CMOS: sensing electronics embedded in mechanical structures. In International Symposium on Circuits and Systems (ISCAS 2006), 21-24 May 2006, Island of Kos, Greece. IEEE, 2006. [doi]

@inproceedings{TejadaA06,
  title = {Microelectromechanical systems in 3D SOI-CMOS: sensing electronics embedded in mechanical structures},
  author = {Francisco Tejada and Andreas G. Andreou},
  year = {2006},
  doi = {10.1109/ISCAS.2006.1693746},
  url = {http://dx.doi.org/10.1109/ISCAS.2006.1693746},
  researchr = {https://researchr.org/publication/TejadaA06},
  cites = {0},
  citedby = {0},
  booktitle = {International Symposium on Circuits and Systems (ISCAS 2006), 21-24 May 2006, Island of Kos, Greece},
  publisher = {IEEE},
}