Experimental evaluation of SnAgCu solder joint reliability in 100-μm pitch flip-chip assemblies

Ye Tian, Xi Liu, Justin Chow, Yi-Ping Wu, Suresh K. Sitaraman. Experimental evaluation of SnAgCu solder joint reliability in 100-μm pitch flip-chip assemblies. Microelectronics Reliability, 54(5):939-944, 2014. [doi]

Abstract

Abstract is missing.