Enhanced Thermal Conductivity and Mechanical Toughness of the Epoxy Resin by Incorporation of Mesogens Without Nanofillers

Kaiyi Tian, Senyuan Yang, Jiaxuan Niu, Hanxiang Wang. Enhanced Thermal Conductivity and Mechanical Toughness of the Epoxy Resin by Incorporation of Mesogens Without Nanofillers. IEEE Access, 9:31575-31580, 2021. [doi]

Abstract

Abstract is missing.