Erman Timurdogan, Zhan Su 0001, Krishna T. Settaluri, Sen Lin, Sajjad Moazeni, Chen Sun, Gerald Leake, Douglas D. Coolbaugh, Benjamin R. Moss, Michele Moresco, Vladimir Stojanovic, Michael R. Watts. An ultra low power 3D integrated intra-chip silicon electronic-photonic link. In Optical Fiber Communications Conference and Exhibition, OFC 2015, Los Angeles, CA, USA, March 22-26, 2015. pages 1-3, IEEE, 2015. [doi]
Abstract is missing.