Israel Tirkel. The effectiveness of variability reduction in decreasing wafer fabrication cycle time. In Winter Simulations Conference: Simulation Making Decisions in a Complex World, WSC 2013, Washington, DC, USA, December 8-11, 2013. pages 3796-3805, IEEE, 2013. [doi]
@inproceedings{Tirkel13,
title = {The effectiveness of variability reduction in decreasing wafer fabrication cycle time},
author = {Israel Tirkel},
year = {2013},
doi = {10.1109/WSC.2013.6721739},
url = {http://dx.doi.org/10.1109/WSC.2013.6721739},
researchr = {https://researchr.org/publication/Tirkel13},
cites = {0},
citedby = {0},
pages = {3796-3805},
booktitle = {Winter Simulations Conference: Simulation Making Decisions in a Complex World, WSC 2013, Washington, DC, USA, December 8-11, 2013},
publisher = {IEEE},
}