Process Variation Characterization and Modeling of Nanoparticle Interconnects for Foldable Electronics

Rasit Onur Topaloglu. Process Variation Characterization and Modeling of Nanoparticle Interconnects for Foldable Electronics. In 9th International Symposium on Quality of Electronic Design (ISQED 2008), 17-19 March 2008, San Jose, CA, USA. pages 498-501, IEEE Computer Society, 2008. [doi]

@inproceedings{Topaloglu08,
  title = {Process Variation Characterization and Modeling of Nanoparticle Interconnects for Foldable Electronics},
  author = {Rasit Onur Topaloglu},
  year = {2008},
  doi = {10.1109/ISQED.2008.165},
  url = {http://doi.ieeecomputersociety.org/10.1109/ISQED.2008.165},
  tags = {modeling, process modeling},
  researchr = {https://researchr.org/publication/Topaloglu08},
  cites = {0},
  citedby = {0},
  pages = {498-501},
  booktitle = {9th International Symposium on Quality of Electronic Design (ISQED 2008), 17-19 March 2008, San Jose, CA, USA},
  publisher = {IEEE Computer Society},
  isbn = {978-0-7695-3117-5},
}