S. Toyoda, A. Shibata, M. Harada, T. Murayama, T. Sakuishi, M. Hatanaka, Y. Morikawa, K. Suu. TSV process solution for 3D-IC. In Mitsumasa Koyanagi, Morihiro Kada, editors, 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012. pages 1-5, IEEE, 2011. [doi]
Abstract is missing.