Design challenges for system-in-package vs system-on-chip

Cynthia Trigas. Design challenges for system-in-package vs system-on-chip. In Proceedings of the IEEE Custom Integrated Circuits Conference, CICC 2003, San Jose, CA, USA, September 21 - 24, 2003. pages 663-666, IEEE, 2003. [doi]

@inproceedings{Trigas03,
  title = {Design challenges for system-in-package vs system-on-chip},
  author = {Cynthia Trigas},
  year = {2003},
  doi = {10.1109/CICC.2003.1249482},
  url = {https://doi.org/10.1109/CICC.2003.1249482},
  researchr = {https://researchr.org/publication/Trigas03},
  cites = {0},
  citedby = {0},
  pages = {663-666},
  booktitle = {Proceedings of the IEEE Custom Integrated Circuits Conference, CICC 2003, San Jose, CA, USA, September 21 - 24, 2003},
  publisher = {IEEE},
  isbn = {0-7803-7842-3},
}