Optimal Parameter Design for IC Wire Bonding Process by Using Fuzzy Logic and Taguchi Method

Jinn-Tsong Tsai, Cheng-Chung Chang, Wen-Ping Chen, Jyh-Horng Chou. Optimal Parameter Design for IC Wire Bonding Process by Using Fuzzy Logic and Taguchi Method. IEEE Access, 4:3034-3045, 2016. [doi]

Abstract

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