Failure and stress analysis of through-aluminum-nitride-via substrates during thermal reliability tests for high power LED applications

M.-Y. Tsai, C. H. Lin, K. F. Chuang, Y. H. Chang, C.-T. Wu, S.-C. Hu. Failure and stress analysis of through-aluminum-nitride-via substrates during thermal reliability tests for high power LED applications. Microelectronics Reliability, 67:120-128, 2016. [doi]

Abstract

Abstract is missing.