TsanKit: artificial intelligence for solder ball head-in-pillow defect inspection

Ting-Chen Tsan, Teng-Fu Shih, Chiou-Shann Fuh. TsanKit: artificial intelligence for solder ball head-in-pillow defect inspection. Mach. Vis. Appl., 32(3):66, 2021. [doi]

Abstract

Abstract is missing.