A study of post-etch wet clean on electrical and reliability performance of Cu/low k interconnections

C. F. Tsang, C. K. Chang, A. Krishnamoorthy, K. Y. Ee, Y. J. Su, H. Y. Li, W. H. Li, L. Y. Wong. A study of post-etch wet clean on electrical and reliability performance of Cu/low k interconnections. Microelectronics Reliability, 45(3-4):517-525, 2005. [doi]

Abstract

Abstract is missing.