H. Tsukamoto, T. Nishimura, S. Suenaga, S. D. McDonald, K. W. Sweatman, K. Nogita. The influence of solder composition on the impact strength of lead-free solder ball grid array joints. Microelectronics Reliability, 51(3):657-667, 2011. [doi]
@article{TsukamotoNSMSN11,
title = {The influence of solder composition on the impact strength of lead-free solder ball grid array joints},
author = {H. Tsukamoto and T. Nishimura and S. Suenaga and S. D. McDonald and K. W. Sweatman and K. Nogita},
year = {2011},
doi = {10.1016/j.microrel.2010.10.012},
url = {http://dx.doi.org/10.1016/j.microrel.2010.10.012},
tags = {composition},
researchr = {https://researchr.org/publication/TsukamotoNSMSN11},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {51},
number = {3},
pages = {657-667},
}