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The influence of solder composition on the impact strength of lead-free solder ball grid array joints

H. Tsukamoto, T. Nishimura, S. Suenaga, S. D. McDonald, K. W. Sweatman, K. Nogita. The influence of solder composition on the impact strength of lead-free solder ball grid array joints. Microelectronics Reliability, 51(3):657-667, 2011. [doi]

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